Apex is happy to announce two new additions to our product family: the SA111 and PA166. Both parts feature our 20mm x 20mm PQ package which addresses the demand from the market for surface mount devices with top-side cooling. The surface mount package style and exceptionally compact size, affords designers the ability to maximize board real estate, allowing for the use of multiple devices in circuit designs where high power density is a critical requirement

SA111 – 650V, 32A Silicon Carbide Half-Bridge Power Module

• High continuous output current – 32 A
• High supply voltage – 650 V
• Fast switching frequency – 1 MHz
• Integrated with digitally controlled gate drive
• Under-voltage lock-out and active miller clamping

Target applications include MRI gradient coil-drive, magnetic bearings, motor drive, test equipment, server-fans, Power Factor Correction (PFC), and AC/DC and DC/DC converters. Complete product information is available online here

PA166 – 1A/4A, 205V High Density, Multi-Purpose Power Amplifier IC

• High continuous output current – 1 A
• High PEAK output current – 4A
• High supply voltage – 205 V
• Internal power dissipation – 2 x 26W
• Temperature compensated current limit with over-current flag
• Surface mount QFP style package with heat slug on top for efficient heat sinking of multiple devices

Target applications include high density voltage or current sources, electrostatic transducers, electrostatic/ electromagnetic deflection, deformable mirror focusing, and piezo electric positioning. Complete product information is available online here.