PKG produces prototypes and medium to large series of Rigid, flexible, rigid-flexible and rigid multilayer PCBs and MCM-Ls using HDI/microvia technology.
Provide double-layer flexible substrates with microvias using reel-to-reel technology.
Flex Rigid-Flex PCB fabrication and electronic contract manufacturing.
Multi-layer, rigid PCBs.
Base material combinations, Polyimide, CIC.
HF-solutions, cavities, edge metal plating
Heat dissipation solutions
High complexity e.g. 5 lamination cycles, HDI-technology
The solutions fulfill the requirements of advanced applications with high-end IC packages: FC, COF, MCM, COB, CSP, BGA, µBGA and TAB
Printed Circuit Boards manufactured are according to ISO, Avionics and MIL standards along with other certifications
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